Paul Ampadu

Paul Ampadu

Associate Professor in the Department of Electrical & Computer Engineering at the University of Rochester

MLK Visiting Scholar 2011-2013

Hosted by Prof. Vladimir Stojanovic, Department of Electrical Engineering and Computer Science

Paul Ampadu is an Associate Professor in the Department of Electrical & Computer Engineering at the University of Rochester

Bio

Paul Ampadu is an Associate Professor in the Department of Electrical & Computer Engineering at the University of Rochester, where he directs the Embedded Integrated System-on-chip (EdISon) research group. As an MLK Visiting Associate Professor, he worked on algorithm and implementation methodology for energy constrained sensing and communication systems and assisted in courses offered under MIT’s new EECS curriculum.

Dr. Ampadu earned his Ph.D. in ECE from Cornell University in 2004. In 1994/1995, he helped Microsoft Corporation ship the world’s first Japanese version of Microsoft Word for the Mac and the first 32-bit version of Office Far East for Windows (Chinese, Japanese, and Korean versions); Dr. Apadu was also a co-technical editor of three Microsoft Press books. He serves on the steering committees of many mentoring and diversity-inclusion organizations and is fluent in many languages, including Chinese.

Publications

Fu, Bo., and Paul Ampadu. Error control for network-on-chip links. New York: Springer Science+Business Media, LLC, 2012.

Wolpert, David, and Paul Ampadu. Managing temperature effects in nanoscale adaptive systems. New York: Springer, 2012.

Yu, Qiaoyan, and Paul Ampadu. Transient and permanent error control for networks-on-chip. New York, NY: Springer, 2012.